Model SDR is purely designed as a dispenser. M size board (250 x 330mm) can be loaded in the compact body. SDR does not use the frame of a mounter but originally designed by focusing the functions required for a dispenser so that it fits the wing space of a chip shooter.
SDR can be put in place of a 1m buffer conveyor without changing the line.
High Rigidity
The compact body makes the machine more rigid. As the rigidity becomes higher in inverse proportion to almost the cube of length, the shorter machine parts used in SDR result in higher rigidity. SDR has realized high rigidity by minimizing the dimension of each machine part as short as possible.
Cost Effective
SDR has achieved a low price by cost effective design. It is a low cost, high performance dispenser that has the required minimum functions.
High Accuracy
SDR uses the technology of high accuracy mounters in many places. The key point in mechanical accuracy required for a dispenser is the coplanarity of the board to the head. If it is not coplanar, the dispense amount changes by positions. SDR achieves a high level of mechanical accuracy by i-Pulse’s high precision assembling technique. The positioning accuracy is also the same level as mounters.
Crank Motion Head
The head drive method is a crank mechanism that is used in reciprocating engines. The nozzle moves up and down in sine curve. The sine curve provides zero speed and zero acceleration at its top and bottom points. The speed when the nozzle touches the board is zero, i.e. no load on the board. The drive source uses a pulse motor and can be programmed at any speed.
Easy Replacement of Syringes
The syringe and the needle are handled in one unit for easy replacement of the syringes.
Easy Operation
The programming device uses interactive interface and easy robot language. The operation is easy even for inexperienced operators. The optional POPCOM software to be used in a PC supports the programming and machine control by PC.
Click Play to view the head’s movement.
Specifications
Board size
L50 x W50 to L330 x W250mm
Board thickness
0.5 to 2mm
Transfer direction
Left to right (OPT: Right to left)
Board positioning
Pin positioning, Front reference (OPT: Rear reference)
Dispense accuracy
+/-0.15mm
Dispense speed
0.3 sec/shot (Optimum conditions: Y 2mm move, dispense time 30ms)
Dispense modes
Glue: 2 points, 1 point, line dispense
Solder paste: 1 point, line dispense
Dispense points
Max approx. 800 points (Depends on programs)
Head
1 head
Dispense method
Air pulse
Power
Single phase AC200V +/-10% (50/60Hz)
Power consumption
1.3KVA
Air consumption
23L/min. (A.N.R)
Air pressure
0.49 to 0.68Mpa (Clean air free from oil and moisture)