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The photograph includes optional items.
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Free-thickness PCB Support Pin
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The PCB backup unit is linked up with board thickness. The PCB support pins don't need to be adjusted the height.
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4-axis Full Servo, High-speed Head
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New design has increased the rigidity. The 4-axis in-line head with independent Z-axis servo control assures high-accuracy and high-speed placement for 0603 (0201) chips to BGA/CSP without giving stress to the components. Further, the modular-concept head design makes the maintenance task easy.
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High-resolution Digital Multi Camera
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The high-resolution digital multi camera assures placement accuracy of +/-50 microns (Accuracy : μ＋3σ< 50μm) for 0603 (0201) and 1005 (0402) chips.
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Auto Conveyor Width Adjustment
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The conveyor width is automatically adjusted by servomotor according to the board data. The unplaceable area at board edge is 3mm.
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High-speed, Nonstop, Consecutive Recognition
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The 4-spindle head nonstop travels over the camera and performs consecutive recognition.
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Board Clamp Conveyor
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The conveyor clamps the board by face from its top and bottom. Firm board clamping assures steady placements.
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ANC (option)
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The nozzle changer (ANC) changes the nozzles attached to the head automatically. (20 nozzle holes)
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Specifications |
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Board size
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L50 x W30mm to L330 x W250mm
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Board thickness
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0.4mm to 3.0mm
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Flow direction
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Left to right
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Placement
speed
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Under optimum conditions
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0.28sec/CHIP
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1608C : 11,100CPH
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SOIC16 : 9,300CPH
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QFP100 (using TSF1, 2-head consecutive pickup) : 2,700 CPH
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Placement
accuracy
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Test setting
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Accuracy ( μ+3σ) : +/-0.05mm/CHIP, +/-0.037mm/ to ☐20mm,
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+/-0.05mm/QFP
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Repeatability (3σ) : +/-0.03mm/CHIP, +/-0.03mm/QFP
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Z-axis control
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4 heads independent AC servo motor
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Component height
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15mm |
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Components applicable
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0603 to 31mm square (NB), SOP/SOJ, QFP, connector,
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PLCC, CSP/BGA (NB : The max. component size is restricted by heads.)
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Component carriers
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8 to 56mm tape, stick, JEDEC tray (when using TSF1)
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Board locating method
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Board Clamp Conveyor, Free-thickness PCB backup,
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Front reference, Auto conveyor width adjustment (servo control)
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Unplaceable area
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3mm from board edge (top and bottom)
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Component types
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16 types (8mm tape conversion)
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Board transfer height
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900+/-10mm |
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Dimensions and weight
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L1,195 x D1,255 x H1,350mm, approx. 750kg
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Power and consumption
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1-phase, AC200 to 240V (-10%/+6%), 50/60Hz, 2.8KVA
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Air and consumption
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Min 0.55MPa, 60L/min A.N.R., clean and dry air
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Others |
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Signal tower |
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